The report, “PCB Encapsulation Market by Resin Type (Epoxy, Acrylic), Curing Type (UV-Cure, Heat Cure, Room Temperature Cure), Application (Consumer Electronics, Automotive Electronics, Medical Devices), Product Type – Global Forecast to 2029″, is projected to reach USD 5.59 billion by 2029, at a CAGR of 8.8% from USD 3.67 billion in 2024. Some of the major forces behind the growth of the PCB encapsulation market include miniaturization of electronics, coupled with increasing electronic functionality, requires them to be better shielded against trouble-free performance across multiple ambient and adverse environments. The increasing requirement from the consumer side for high-quality and rugged electronics, such as smartphones, tablets, and wearables, has also turned into one of the major driving forces. Growing applications of electric vehicles and ADAS in the automotive sector further enhance the demand for reliable PCB protection, which has to withstand challenging conditions. The industrial and aerospace industries also have a high demand for robust electronic systems working in extreme environments, thereby further boosting the market. Improvements in adhesive formulations with regard to thermal stability, chemical resistance, and mechanical strength are critical for the growth of the market.
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• 257 Market data Tables
• 58 Figures
• 240 Pages and in-depth TOC on “PCB Encapsulation Market– Global Forecast to 2029″
Some of the prominent key players are:
- Henkel AG & Co. KGaA (Germany),
- H.B. Fuller Company (US),
- Parker-Hannifin Corporation (US),
- Dow (US),
- DuPont (US),
- Nagase ChemteX Corporation (Japan), and many more….
Opportunity: Advancements in the Automotive And Aerspace Sectors
The aerospace and automotive sectors are ripe with tremendous potential for the PCB encapsulation market. It is forecasted that advanced electronic content will be swiftly adopted by both industries toward improvements in performance, safety, and functionality. For aerospace, there is an increased requirement for long-lasting, high-reliability PCBs to deliver requirements such as avionics, navigation systems, and in-flight entertainment. Components have to withstand extremely stringent conditions caused by high altitudes, temperature fluctuations, and vibrations, whose reliability will require adhesives superior to conventional ones for PCB protection. The move of the automotive industry toward EVs, autonomous driving, and connected car technologies requires robust protection in their PCBs. The electronics in vehicles are exposed to extreme environments, with a large amount of heat, moisture, and chemicals. Advanced adhesives are required that provide excellent thermal management, mechanical stability, and environmental resistance.
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“UV cure by application industry segment is projected to be largest, in terms of value, during the forecast period.”
The UV cure adhesives segment is likely to show the fastest growth in the category of curing type in the PCB encapsulation market. This could be attributed to the several advantages these materials provide in efficiency, performance, and versatility. The property of these adhesives is that they have quick curing under ultraviolet radiation. Not only this makes the processing times much shorter as compared to traditional methods of curing, but it also enhances production efficiency and throughput, which has made them very attractive to manufacturers. In addition to the general purpose use, it also provides very good adhesion, thermal stability, and chemical resistance to ensure protection of the PCBs reliably in harsh applications. Its curing process allows only the intended areas to be coated accurately, providing material and consistent protection throughout the entire PCB. The demand for high-performance electronic parts is expected to become evident because of the introduction of better products in the future, particularly for conditions in consumer electronics, automotive, and industrial applications. Adhesive solutions for such high-performance, efficient, and reliable adhesives, important to the function of the electronic parts, further drive the demand of UV cure adhesives. Improved UV-cure formulations have introduced advantages such as better flexibility and improved resistance to the environment, thus broadening their field of application. These, coupled with pressure for more effective and eco-friendly manufacturing processes, make UV cure adhesives the fastest growing segment in the PCB encapsulation market.
“Asia-Pacific is expected to be the fastest market for PCB encapsulation market during the forecast period, in terms of value.”
Asia-Pacific region the fastest-growing in the PCB encapsulation market. The region has a huge, well established electronics manufacturing base. Countries that constitute this region, like China, Japan, South Korea, and Taiwan, are frontline countries when it comes to the production of consumer electronics, automotive electronics, and industrial electronic components. This high concentration of electronics manufacturing drives significant demand for PCB encapsulations. Added to this, the rapid economic growth in the Asia-Pacific region, coupled with increasing urbanization, resulted in high adoption rates for the advanced electronic devices and hence provided a further boost to the market. This region also benefits from massive investments made in research and development that lead to innovation in adhesives technologies and processes associated with their production. Furthermore, the rapid rise of the automotive industries in countries such as China and India increases the production volume of electric vehicles, thereby boosting the demand for reliable PCB protection solutions. These are some of the factors that make Asia-Pacific a prominent growth driver for the global PCB encapsulation market.