The “Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region – Global Forecast to 2029″, is 43.9 billion in 2024 and is projected to reach USD 70.9 billion by 2029, at a CAGR of 10.1%. The market growth is driven by increasing demand from consumer electronics industry, growing miniaturization and densification in the electronic sector and adoption of emerging technologies like 5G and autonomous vehicles.
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- 140 Market data Tables
- 40 Figures
- 200 Pages and in-depth TOC on “Semiconductor & IC Packaging Materials Market – Global Forecast to 2029”.
This report also provides a comprehensive analysis of the companies listed below:
The key players in semiconductor & IC packaging materials market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc. These companies are strong in their home regions and explore geographic diversification alternatives to grow their businesses. They focus on increasing their market shares through new product launches and other expansions.