The report “SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), application, Process, & Region (North America, Europe, APAC, South America, MEA) – Global Forecast 2028″, is expected to grow at a CAGR of 37.5% during the forecast period, from an estimated USD 0.4 billion in 2023 to USD 2.2 billion by 2028. Growing Consumption of Consumer Electronics, growing demand for SIC-based power devices, Development of advanced polishing consumables, and Adoption of SiC wafers in radio frequency (RF) devices provide growth opportunities for Sic wafer polishing Market.
Download PDF
Browse
• 127 Market data Tables
• 48 Figures
• 168 Pages and in-depth TOC on “SiC Wafer Polishing Market – Global Forecast to 2028”
Some of the prominent key players are:
- Kemet International (UK)
- Entegris (US)
- Iljin Diamond (US)
- Fujimi Corporation (Japan)
- Saint-Gobain (US)
Make an Enquiry
Driver: Development of advanced polishing consumable
The advancement of advanced polishing consumables has a significant impact on the growth of the SiC wafer polishing market. Polishing consumables are items used in the wafer polishing process, including abrasive slurries, pads, and chemicals. The developments in these consumables have given various benefits to the SiC wafer polishing market, driving its growth and efficiency. One of the primary advantages of modern polishing consumables is their capacity to produce better levels of precision and uniformity in the wafer polishing process. As SiC wafers become thinner and more complicated in design, the demand for precise and consistent polishing grows. Advanced consumables are meant to enable greater control over material removal rates, surface roughness, and planarization, resulting in higher overall wafer quality. This is extremely critical for SiC wafers, as their unique properties require meticulous polishing to maintain their desired characteristics. Furthermore, modern polishing consumables improve productivity and cost-effectiveness in the SiC wafer polishing process. They are designed to improve polishing efficiency, reduce polishing time, and reduce material waste.
Based on process, the chemical mechanical polishing segment accounts for the largest share of the overall market.Based on application, The chemical polishing segment accounts for the largest share of the globally; because of its effectiveness in eliminating faults and contaminants from SiC wafers, CMP is a popular method for producing reliable and high-quality devices. As a result of these benefits, CMP has the fastest-growing market share in the SiC wafer polishing market and has emerged as the go-to technology for semiconductor manufacturers seeking optimal wafer surface quality and productivity. Asia Pacific is expected to account for the largest share of the global market during the forecast period.Based on the region the Asia Pacific region is home to a large consumer electronics market, with a growing population and rising disposable incomes driving the demand for smartphones, tablets, and other electronic devices. SiC-based power devices are increasingly being incorporated into these consumer electronics for enhanced efficiency and longer battery life, further propelling the need for polished SiC wafers. |
About MarketsandMarkets™
MarketsandMarkets™ has been recently recognized as one of America’s best management consulting firms by Forbes, as per their recent report.
Founded in 2009, MarketsandMarkets recognized uncharted business potentials within disruptive trends, forecasting a surge of $25 trillion in new B2B revenues by 2030. In our 13-year journey, we’ve collaborated with over 10,000 companies, generating $140+ billion in revenue impact. From a market research publisher, we’ve transformed into a growth-enabling leader, backed by a 1500+ strong team.