The report “Thermally Conductive Filler Dispersants Market by Dispersant Structure Type (Silicone-Based, Non-Silicone Based), Filler Material (Ceramic, Metal, Carbon-Based), Application (Thermal Insulation Glue), End-Use Industry, & Region – Global Forecast to 2028″, is projected to reach USD 0.4 billion by 2028, at a CAGR of 10.2% from USD 0.3 billion in 2023. The major drivers for the thermally conductive filler dispersants market are growing demand for electronics products. The ability to control the dispersion of thermally conductive fillers is crucial in enhancing the thermal conductivity and mechanical properties of thermal interface materials (TIMs) application. Limited improvement in overall thermal conductivity is the major restraint in this market. Opportunities for the market include development of new and improved fillers, growing demand for electric vehicles.
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• 282 Market data Tables
• 45 Figures
• 269 Pages and in-depth TOC on “Thermally Conductive Filler Dispersants Market – Global Forecast to 2028”
Some of the prominent key players are:
- BYK (Germany)
- Shin-Etsu Chemical (Japan)
- Dow Chemical Company (US)
- JNC Corporation (Japan)
- Momentive Performance Materials (US)
- Kusumoto Chemicals (Japan)
- Evonik (Germany)
- Croda International (UK)
- Lubrizol Corporation (US)
- Wacker Chemie (Germany)
Driver: Increasing demand for consumer electronics products
Consumer electronics, such as smartphones, tablets, laptops, and gaming consoles, generate significant amounts of heat during operation. Efficient heat dissipation is crucial to ensure the optimal performance and longevity of these devices. Thermally conductive filler dispersants play a vital role in enhancing the thermal conductivity of polymer composites used in electronic components and heat sinks. Effective heat dissipation through the use of thermally conductive filler dispersants helps to prevent overheating, which can lead to performance degradation and reduced reliability of electronic components.
| By end-use industry, electronics is the largest in thermally conductive filler dispersants market, in 2022.
Electronics is the largest end-use segment. TIMs are commonly used for transferring thermal conductivity from the CPU or GPU to heat sink coolers. Electronic products such as CPUs, chipsets, graphics cards, and hard disk drives, are susceptible to failure in case of overheating. Thermally conductive filler dispersants for TIMs are used in computers to remove the excess heat to maintain the components operating temperature limits. They are used in computers to optimize performance and reliability for smooth functioning. They are used for improving the heat flow in computers by filling voids or irregularities between the heat sink and SSE base plate mounting surfaces. The increased demand for electronic products is driving the market for thermally conductive filler dispersants. Asia Pacific is projected to be fastest growing amongst other regions in the thermally conductive filler dispersants market, in terms of value.Based on the region, the thermally conductive filler dispersants market is segmented into Asia Pacific, North America, Europe, South America, and the Middle East & Africa. Currently, Asia Pacific is the fastest growing market for thermally conductive filler dispersants. The region has a large and growing population with increasing disposable income, a rising awareness of health and wellness, and the expanding middle-class population and changing lifestyles have led to a surge in demand for electronic products, and electric vehicles. Additionally, advancements in technologies and increased R&D activities in the thermally conductive filler dispersants market have further fueled the growth of the market in Asia Pacific. |
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